Congrats Hong Kong Univ.
Researchers at The Hong Kong University of Science and Technology (HKUST) have fabricated microscopically-small lasers directly on silicon, enabling the future-generation microprocessors to run faster and less power-hungry – a significant step towards light-based computing.
The innovation, made by Prof Kei-may Lau, Fang Professor of Engineering and Chair Professor of the Department of Electronic and Computer Engineering, in collaboration with the University of California, Santa Barbara; Sandia National Laboratories and Harvard University, marks a major breakthrough for the semiconductor industry and well beyond.
Silicon forms the basis of everything from solar cells to the integrated circuits at the heart of our modern electronic gadgets. However, the crystal lattice of silicon and of typical laser materials could not match up, making it impossible to integrate the two materials until now, when Prof Lau’s group managed to integrate subwavelength cavities — the essential building blocks of their tiny lasers — onto silicon, allowing them to create and demonstrate high-density on-chip light-emitting elements. The finding was recently published as the cover story on Applied Physics Letters.
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