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Dexterous robotic hand integrates thermal, inertial and force sensors

While roboticists have introduced increasingly advanced systems over the past decades, most existing robots are not yet able to manipulate objects with the same dexterity and sensing ability as humans. This, in turn, adversely impacts their performance in various real-world tasks, ranging from household chores to the clearing of rubble after natural disasters and the assembly or performing maintenance tasks, particularly in high-temperature working environments such as steel mills and foundries, where elevated temperatures can significantly degrade performance and compromise the precision required for safe operations.

Researchers at the University of Southern California recently developed the MOTIF (Multimodal Observation with Thermal, Inertial, and Force sensors) hand, a new robotic hand that could improve the object manipulation capabilities of humanoid robots. The innovation, presented in a paper posted to the arXiv preprint server, features a combination of sensing devices, including , a depth sensor, a , inertial measurement unit (IMU) sensors and a visual sensor.

“Our paper emerged from the need to advance robotic manipulation beyond traditional visual and tactile sensing,” Daniel Seita, Hanyang Zhou, Wenhao Liu, and Haozhe Lou told Tech Xplore. “Current multi-fingered robotic hands often lack the integrated sensing capabilities necessary for involving thermal awareness and responsive contact feedback.”

Quantum Breakthrough: Physicists Discover “Lonely” Spinon That Defies Magnetic Norms

A new discovery reveals how a mysterious quantum spin excitation — a solitary spinon — can exist alone, hinting at advances in quantum technologies. Scientists from the Faculty of Physics at the University of Warsaw and the University of British Columbia have identified a way for a “lone spinon”

Yuval Noah Harari

An order of intelligence that at the moment is alien to us.


#LLM #largelanguagemodels #chatgpt.

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Industrial Electronics

Growth in 2.5D and 3D packaging solutions has accelerated off-the-board technology and the components which leverage it, both in terms of the fastest digital processors but also in proprietary ASICs and application processors. As high-bandwidth digital channels approach the practical limits of copper interconnects, silicon photonics and on-PCB/in-package optical interconnects may emerge as the next transformative wave of off-the-board technology.

This opinion is shared by insiders within the PCB and packaging side of the industry.

“Off the board technology is growing at an amazing rate, and isn’t being replaced by optical solutions, it’s enabling more optical solutions,” said Joe Dickson, senior VP chip-to-chip reliability and innovation at WUS PCB International. “They are not competition, they are tools to go much farther than we can today.”