A new technique using liquid metals to create integrated circuits that are just atoms thick could lead to the next big advance for electronics.
The process opens the way for the production of large wafers around 1.5 nanometres in depth (a sheet of paper, by comparison, is 100,000nm thick).
Other techniques have proven unreliable in terms of quality, difficult to scale up and function only at very high temperatures — 550 degrees or more.
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