A new form of electronics manufacturing which embeds silicon nanowires into flexible surfaces could lead to radical new forms of bendable electronics, scientists say.
In a new paper published today in the journal Microsystems and Nanoengineering, engineers from the University of Glasgow describe how they have for the first time been able to affordably ‘print’ high-mobility semiconductor nanowires onto flexible surfaces to develop high-performance ultra-thin electronic layers.
Those surfaces, which can be bent, flexed and twisted, could lay the foundations for a wide range of applications including video screens, improved health monitoring devices, implantable devices and synthetic skin for prosthetics.
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