Scientists from Nanyang Technological University, Singapore (NTU Singapore), have developed a new way to cure adhesives using a magnetic field.
Conventional adhesives like epoxy which are used to bond plastic, ceramics and wood are typically designed to cure using moisture, heat or light. They often require specific curing temperatures, ranging from room temperature up to 80 degrees Celsius.
The curing process is necessary to cross-link and bond the glue with the two secured surfaces as the glue crystallizes and hardens to achieve its final strength.
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