ASML President and CTO Martin van den Brink said:
“Intel’s vision and early commitment to ASML’s High-NA EUV technology is proof of its relentless pursuit of Moore’s Law. Compared to the current EUV systems, our innovative extended EUV roadmap delivers continued lithographic improvements at reduced complexity, cost, cycle time and energy that the chip industry needs to drive affordable scaling well into the next decade.”
Intel plans to start high-volume manufacturing (HVM) in 2025, which is also when the company will be using its 18A (1.8nm) fabrication technology. To do so, Intel has been experimenting for quite a while when it first obtained ASML’s Twinscan EXE:5000, which was the industry’s first EUV scanner with a 0.55 numerical aperture. Today, the company ordered ASML’s next-generation High-NA tool, the Twinscan EXE:5200.
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