Apr 29, 2023

MIT scientists innovate to create more powerful and denser computer chips

Posted by in categories: information science, robotics/AI

“The new capability of low thermal budget growth on an 8-inch scale enables the integration of this material with silicon CMOS technology and paves the way for its future electronics application.”

With our pockets and houses filling with electronic gadgets and AI and Big Data fueling the rise of data centers, there is a need for more computer chips— more powerful, potent, and denser than ever.

These chips are traditionally made with boxy 3D materials bulky in nature, making stacking these into layers difficult.

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