Lifeboat Foundation

Hybrid bonding opens up whole new level of performance in packaging, but it’s not the only improvement.

The first wave of chips is hitting the market using a technology called hybrid bonding, setting the stage for a new and competitive era of 3D-based chip products and advanced packages.

AMD is the first vendor to unveil chips using copper hybrid bonding, an advanced die-stacking technology that enables next-generation 3D-like devices and packages. Hybrid bonding stacks and connects chips using tiny copper-to-copper interconnects, providing higher density and bandwidth than existing chip-stacking interconnect schemes.

When I was ten years old, I discovered computers. My first machine was a PDP-10 mainframe system at the medical center where my father worked. I taught myself to write simple programs in the BASIC computer language. Like any ten-year-old, I was especially pleased to discover games on the computer. One game was simply labeled “ADVENT.” I opened it and saw:

You are standing at the end of a road before a small brick building. Around you is a forest. A small stream flows out of the building and down a gully.

I figured out that I could move around with commands like “go north” and “go south.” I entered the building and got food, water, keys, a lamp. I wandered outside and descended through a grate into a system of underground caves. Soon I was battling snakes, gathering treasures, and throwing axes at pesky attackers. The game used text only, no graphics, but it was easy to imagine the cave system stretching out below ground. I played for months, roaming farther and deeper, gradually mapping out the world.

Researchers have found over 20,000 instances of publicly exposed data center infrastructure management (DCIM) software that monitor devices, HVAC control systems, and power distribution units, which could be used for a range of catastrophic attacks.

Data centers house costly systems that support business storage solutions, operational systems, website hosting, data processing, and more.

The buildings that host data centers must comply with strict safety regulations concerning fire protection, airflow, electric power, and physical security.

Often, we need to power a 5V-craving project of ours on the go. So did [Burgduino], and, unhappy with solutions available, designed their own 5V UPS! It takes a cheap powerbank design and augments it with a few parts vital for its UPS purposes.

You might be tempted to reach for a powerbank when facing such a problem, but most of them have a fatal flaw, and you can’t easily tell a flawed one apart from a functioning one before you buy it. This flaw is lack of load sharing – ability to continue powering the output when a charger is inserted. Most store-bought powerbanks just shut the output off, which precludes a project running 24/7 without powering it down, and can cause adverse consequences when something like a Raspberry Pi is involved.

Understandably, [Burgduino] wasn’t okay with that. Their UPS is based on the TP5400, a combined LiIon charging and boost chip, used a lot in simple powerbanks, but not capable of load sharing. For that, an extra LM66100 chip – an “ideal diode” controller is used. You might scoff at it being a Texas Instruments part, but it does seem to be widely available and only a tad more expensive than the TP5400 itself! The design is open hardware, with PCB files available on EasyEDA and the BOM clearly laid out for easy LCSC ordering.

At Apple’s World Wide Developer Conference today, the company made a major shift in their embrace of virtual reality with several new VR announcements during the event’s opening keynote.

Though well loved, Apple’s computer lineup got somewhat left in the dust at the launch of the Rift and Vive, both of which had hardware requirements that exceeded what Apple had on offer. To that end, the company largely steered clear of talking about VR publicly.

Today marks a major shift in Apple’s public support for virtual reality. VR was a recurrent theme throughout the keynote today, highlighting their belief in the importance of the medium. Here’s an overview of everything they announced:

Although Christmas may be several weeks behind us, various colorful LED contraptions can nowadays be found in our houses at any time of year. [Tim] got his hands on an LED curtain that came with a remote control that allows the user to set not only the color of the LEDs as a whole but also to run simple animations. But these were not your standard WS2812B strips with data lines: all the LEDs were simply connected in parallel with just two wires, so how was this even possible?

[Tim] hooked up his oscilloscope to the LED strings to find out how they worked, detailing the results in a comprehensive blog post. As it turns out, the controller briefly shorts the LED strip’s supply voltage to generate data bits, similar to the way old pulse-dialing phones worked. A tiny chip integrated into each LED picks up these pulses, but retains its internal state thanks to a capacitor that keeps the chip powered when the supply line goes low.

After reverse-engineering the protocol, [Tim] went on to implement a similar design using an ATMega328P as a controller and an ATtiny10 as the LED driver. With just a few lines of code and a 100 nF buffer capacitor across the ATtiny’s power pins, [Tim] was able to turn an LED on and off by sending pulses through the supply lines. Some work still needs to be done to fully implement a protocol as used in the LED strings, but as a proof-of-concept it shows that this kind of power-line communication is possible with standard components.

Researchers from the University of Illinois developed GPU-accelerated software to simulate a cell that metabolizes and grows like a living cell.

Every living cell contains its own bustling microcosm, with thousands of components responsible for energy production, protein building, gene transcription and more.

Scientists at the University of Illinois at Urbana-Champaign have built a 3D simulation that replicates these physical and chemical characteristics at a particle scale — creating a fully dynamic model that mimics the behavior of a living cell.

Continue reading “NVIDIA GPUs Enable Simulation of a Living Cell” »

A team of researchers from French, Israeli, and Australian universities has explored the possibility of using people’s GPUs to create unique fingerprints and use them for persistent web tracking.

The results of their large-scale experiment involving 2,550 devices with 1,605 distinct CPU configurations show that their technique, named ‘DrawnApart,’ can boost the median tracking duration to 67% compared to current state-of-the-art methods.

This is a severe problem for user privacy, which is currently protected by laws that focus on acquiring consent to activate website cookies.

We might be amidst a chip shortage, but if you enjoy reverse-engineering, there’s never a shortage of intriguing old chips to dig into – and the 2513N 5×7 character ROM is one such chip. Amidst a long thread probing a few of these (Twitter, ThreadReader link), [TubeTime] has realized that two address lines were shorted inside of the package. A Twitter dopamine-fueled quest for truth has led them to try their hand at making the chip work anyway. Trying to clear the short with an external PSU led to a bond wire popping instead, as evidenced by the ESD diode connection disappearing.

A dozen minutes of sandpaper work resulted in the bare die exposed, making quick work of the bond wires as a side effect. Apparently, having the bond pads a bit too close has resulted in a factory defect where two of the pads merged together. No wonder the PSU wouldn’t take that on! Some X-acto work later, the short was cleared. But without the bond wires, how would [TubeTime] connect to it? This is where the work pictured comes in. Soldering to the remains of the bond wires has proven to be fruitful, reviving the chip enough to continue investigating, even if, it appears, it was never functional to begin with. The thread continued on with comparing ROMs from a few different chips [TubeTime] had on hand and inferences on what could’ve happened that led to this IC going out in the wild.

Such soldering experiments are always fun to try and pull off! We rarely see soldering on such a small scale, as thankfully, it’s not always needed, but it’s a joy to witness when someone does IC or PCB microsurgery to fix factory defects that render our devices inoperable before they were even shipped. Each time that a fellow hacker dares to grind the IC epoxy layers down and save a game console or an unidentified complex board, the world gets a little brighter. And if you aren’t forced to do it for repair reasons, you can always try it in an attempt to build the smallest NES in existence!